u赢电竞apk晶片
Item
4"
Unit
Dimension
Diameter:
100 ± 0.15
mm
Thickness:
650 ± 20
um
Primary Flat:
30+1.0
mm
Orientation
Surface-cut:
C plane : Tilt 0.2°±0.1° in M axis /
~
Primary Flat:
A plane : 0° ± 0.15°
~
Flatness
Bow:
0 ~ (-10)
um
Warp:
≤ 20
um
Total Thickness Variation (TTV):
≤ 10
um
LTV
≤2.5
um
Front side Roughness
≤0.2
nm
Back side Roughness
0.8-1.2
um
Cleanliness
No particles and fingerprints
~
4.Material Quality
High-purity mono-crystal Al2O3
~
5.Package
Wafers are packed in cleaned wafer cassettes containing 25 wafers under clean room environment.
~
6.Trace Ability
Wafers shall be traceable with respect to cassette number. The wafer box should be marked with a removable label showing the date, the cassette number and the quantity.
~
7.Laser Mark
Front or Back side
~